ppc440ep Applied Micro Circuits Corporation (AMCC), ppc440ep Datasheet - Page 18

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ppc440ep

Manufacturer Part Number
ppc440ep
Description
Powerpc 440ep Embedded Processor
Manufacturer
Applied Micro Circuits Corporation (AMCC)
Datasheet

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Assembly Recommendations
Table 3. Recommended Reflow Soldering Profile
Table 4. JEDEC Moisture Sensitivity Level and Ball Composition
18
Revision 1.29 – May 07, 2008
Average ramp-up rate
Preheat
Time Maintained Above:
Peak Temperature
Time within 5°C of Actual Peak Temperature
Ramp-down Rate
Time 25°C to Peak Temperature
MSL Level
Solder Ball Metallurgy
– Temperature Min
– Temperature Max
– Time (min to max)
– Temperature
– Time
Data Sheet
Profile Feature
3
63Sn/37Pb
3°C/second max
100°C
150°C
60-120 Seconds
183°C
60-150 Seconds
225 +0/-5°C
10-30 Seconds
6°C/Second Max
6 Minutes Max
Sn-Pb Eutectic Assembly
Sn-Pb Eutectic Assembly
440EP – PPC440EP Embedded Processor
3°C/second max
150°C
180°C
60-120 Seconds
230°C
30-50 Seconds
260 +5/-0°C
10-20 Seconds
6°C/Second Max
8 Minutes Max
3
Sn/4Ag/05Cu
Pb Free Reflow Assembly
Pb Free Reflow Assembly
AMCC Proprietary

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