mt5vddt1672hy-335 Micron Semiconductor Products, mt5vddt1672hy-335 Datasheet

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mt5vddt1672hy-335

Manufacturer Part Number
mt5vddt1672hy-335
Description
128mb, 256mb X72, Ecc, Sr 200-pin Ddr Sodimm
Manufacturer
Micron Semiconductor Products
Datasheet
DDR SDRAM Small-Outline DIMM
MT5VDDT1672H – 128MB
MT5VDDT3272H – 256MB
For component data sheets, refer to Micron’s Web site:
Features
• 200-pin, small-outline dual in-line memory module
• Fast data transfer rates: PC-2100, PC-2700,
• 128MB
• Supports ECC error detection and correction
• V
• V
• JEDEC-standard 2.5V I/O (SSTL_2-compatible)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
• Internal, pipelined double data rate (DDR)
• Bidirectional data strobe (DQS) transmitted/
• Differential clock inputs (CK and CK#)
• Four internal device banks for concurrent operation
• Selectable burst lengths (BL): 2, 4, or 8
• Auto precharge option
• Auto refresh and self refresh modes: 7.8125µs
• Serial presence-detect (SPD) with EEPROM
• Selectable READ CAS latency for maximum
• Gold edge contacts
Table 1:
PDF: 09005aef80a8e793/Source: 09005aef80a8e767
dd5c16_32x72h.fm - Rev. F 2/07 EN
(SODIMM)
or PC-3200
aligned with data for WRITEs
architecture; two data accesses per clock cycle
received with data (source-synchronous data
capture)
maximum average periodic refresh interval
compatibility
Speed
Grade
DD
DDSPD
-26A
-40B
-335
-262
-265
= V
2
DD
= +2.3V to +3.6V
(16 Meg x 72) and 256MB (32 Meg x 72)
Q = +2.5V
Industry Nomenclature
Key Timing Parameters
Products and specifications discussed herein are subject to change by Micron without notice.
PC-2700
PC-2100
PC-2100
PC-2100
PC-3200
CL = 3
400
128MB, 256MB: (x72, ECC, SR) 200-Pin DDR SODIMM
Data Rate (MT/s)
www.micron.com
CL = 2.5
333
333
266
266
266
1
Figure 1:
Notes: 1. Contact Micron for industrial temperature
Options
• Operating temperature
• Package
• Memory clock, frequency, CAS latency
• PCB height
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 200-pin SODIMM (standard)
– 200-pin SODIMM (Pb-free)
– 5ns (200 MHz), 400 MT/s, CL = 3
– 6ns (167 MHz), 333 MT/s, CL = 2.5
– 7.5ns (133 MHz), 266 MT/s, CL = 2
– 7.5ns (133 MHz), 266 MT/s, CL = 2
– 7.5ns (133 MHz), 266 MT/s, CL = 2.5
– 31.75mm (1.25in)
CL = 2
266
266
266
266
200
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. Consult factory for product availability.
3. -40B only available for 256MB modules.
Module height: 31.75mm (1.25in)
module offerings.
200-Pin SODIMM (MO-224 R/C C)
t
(ns)
RCD
15
15
15
20
20
A
A
1
≤ +85°C)
≤ +70°C)
©2004 Micron Technology, Inc. All rights reserved.
(ns)
t
2
15
15
15
20
20
RP
Marking
Features
None
-40B
-26A
-335
-262
-265
(ns)
t
55
60
60
65
65
RC
G
Y
I
3

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mt5vddt1672hy-335 Summary of contents

Page 1

... DDR SDRAM Small-Outline DIMM MT5VDDT1672H – 128MB MT5VDDT3272H – 256MB For component data sheets, refer to Micron’s Web site: Features • 200-pin, small-outline dual in-line memory module (SODIMM) • Fast data transfer rates: PC-2100, PC-2700, or PC-3200 2 • 128MB (16 Meg x 72) and 256MB (32 Meg x 72) • ...

Page 2

... Table 2: Addressing Refresh count Row addressing Device bank addressing Device configuration Column addressing Module rank addressing Table 3: Part Numbers and Timing Parameters Base device: MT46V16M16 Module 2 Part Number Density MT5VDDT1672H(I)G-335__ MT5VDDT1672H(I)Y-335__ MT5VDDT1672H(I)G-262__ MT5VDDT1672H(I)Y-262__ MT5VDDT1672H(I)G-26A__ MT5VDDT1672H(I)Y-26A__ ...

Page 3

Pin Assignments and Descriptions Table 5: Pin Assignments 200-Pin SODIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol 101 REF DQ19 103 SS ...

Page 4

... DQ and DQS pins. Serial presence-detect data: SDA is a bidirectional pin used to transfer addresses and data into and out of the presence-detect portion of the module. Serial clock for presence-detect: SCL is used to synchronize the presence- detect data transfer to and from the module. ...

Page 5

Functional Block Diagram Figure 2: Functional Block Diagram S0# CS# DQS0 UDQS DM0 UDM DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ U1 DQ7 DQ DQS1 LDQS DM1 LDM DQ8 DQ DQ9 DQ DQ10 ...

Page 6

... DDR SDRAM modules incorporate serial presence-detect (SPD). The SPD function is implemented using a 2,048-bit EEPROM. This nonvolatile storage device contains 256 bytes. The first 128 bytes can be programmed by Micron to identify the module type and various SDRAM organizations and timing parameters. The remaining 128 bytes of storage are available for use by the customer ...

Page 7

... Electrical Specifications Stresses greater than those listed in Table 7 may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions above those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reli- ability ...

Page 8

... Component AC Timing and Operating Conditions Recommended AC operating conditions are given in the DDR component data sheets. Component specifications are available on Micron’s Web site. Module speed grades correlate with component speed grades, as shown in Table 8. Table 8: Module and Component Speed Grades Module Speed Grade ...

Page 9

I Specifications DD Table 9: DDR I Specifications and Conditions – 128MB DD Values shown for MT46V16M16 DDR SDRAM only and are computed from values specified in the 256Mb (16 Meg x 16) component data sheet Parameter/Condition Operating one bank ...

Page 10

Table 10: DDR I Specifications and Conditions – 256MB DD Values shown for MT46V32M16 DDR SDRAM only and are computed from values specified in the 512Mb (32 Meg x 16) component data sheet Parameter/Condition Operating one bank active-precharge current: t ...

Page 11

Serial Presence-Detect Table 11: Serial Presence-Detect EEPROM DC Operating Conditions All voltages referenced to V Parameter/Condition Supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output low voltage 3mA OUT Input ...

Page 12

... Total number of bytes in SPD device 2 Fundamental memory type 3 Number of row addresses on assembly 4 Number of column addresses on assembly 5 Number of physical ranks on DIMM 6 Module data width 7 Module data width (continued) 8 Module voltage interface levels t 9 SDRAM cycle time, CK 2.5 10 SDRAM access from clock, 11 Module configuration type 12 ...

Page 13

... CK set to 7ns (0 x 70) for optimum BIOS compatibility. Actual device t RAS used for -262/-26A/-265 modules is calculated from RP, RCD, and RAP for -335 modules indicated as 18ns to align with industry Micron Technology, Inc., reserves the right to change products or specifications without notice. 13 Serial Presence-Detect 128MB 256MB 80 80 ...

Page 14

... Total number of bytes in SPD device 2 Fundamental memory type 3 Number of row addresses on assembly 4 Number of column addresses on assembly 5 Number of physical ranks on DIMM 6 Module data width 7 Module data width (continued) 8 Module voltage interface levels t 9 SDRAM cycle time, CK SDRAM access from clock, 11 Module configuration type 12 ...

Page 15

... SPD revision 63 Checksum for bytes 0–62 64 Manufacturer’s JEDEC ID code 65–71 Manufacturer’s JEDEC ID code 72 Manufacturing location 73–90 Module part number (ASCII) 91 PCB identification code 92 Identification code (continued) 93 Year of manufacture in BCD 94 Week of manufacture in BCD 95–98 Module serial number 99–127 Reserved for manufacturer-specific data PDF: 09005aef80a8e793/Source: 09005aef80a8e767 dd5c16_32x72h ...

Page 16

... TYP TYP PIN 1 63.60 (2.504) TYP Back view U6 ® their respective owners. 16 Module Dimensions U5 31.90 (1.256) 31.60 (1.244) 20.00 (0.787) TYP PIN 199 TYP PIN 2 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2004 Micron Technology, Inc. All rights reserved. 3.80 (0.150) MAX 1 ...

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