mt9vddf6472phy-335 Micron Semiconductor Products, mt9vddf6472phy-335 Datasheet - Page 19

• Manufacturer Part Number: mt9vddf6472phy-335
• Description: 256mb, 512mb X72, Ecc, Pll, Sr 200-pin Ddr Sodimm
• Manufacturer: Micron Semiconductor Products

Thermal Specifications
Figure 6:
PDF: 09005aef81eef7d4/Source: 09005aef81eef0df
DDF9C32_64x72PH_2.fm - Rev. A 1/06 EN
100
90
80
70
60
50
40
30
20
Component Case Temperature vs. Air Flow
10. Temperature versus air speed data is obtained by performing experiments with the system
11. The memory diagnostic software used for determining worst-case component tempera-
8. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM)
9. The component case temperature measurements shown above were obtained experimen-
across all modules.
tally. The typical system to be used for experimental purposes is a dual-processor 600 MHz
work station, fully loaded, with four comparable registered memory modules. Case tem-
peratures charted represent worst-case component locations on modules installed in the
internal slots of the system.
motherboard removed from its case and mounted in a Eiffel-type low air speed wind tun-
nel. Peripheral devices installed on the system motherboard for testing are the proces-
sor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel
test chamber.
tures is a memory diagnostic software application developed for internal use by Micron
Technology, Inc.
T
T
max
ave
- memory stress software
- memory stress software
256MB, 512MB: (x72, ECC, PLL, SR) 200-Pin DDR SODIMM
T
ave
Air Flow (meters/sec)
- 3D gaming software
19
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Ambient Temperature = 25º C
Minimum Air Flow
Thermal Specifications
©2005 Micron Technology, Inc. All rights reserved.