mt9htf12872pz Micron Semiconductor Products, mt9htf12872pz Datasheet - Page 8

• Manufacturer Part Number: mt9htf12872pz
• Description: 1gb X72, Ecc, Sr 240-pin Ddr2 Sdram Rdimm
• Manufacturer: Micron Semiconductor Products

Electrical Specifications
Table 6:
PDF: 09005aef83c641c6/Source: 09005aef83c6415f
HTF9C128x72pz.fm - Rev. A 11/09 EN
V
V
Symbol
DD
IN
I
VREF
, V
T
I
T
/V
OZ
I
C
A
I
1
DDQ
OUT
Absolute Maximum Ratings
Parameter
V
Voltage on any pin relative to V
Input leakage current; Any input 0V ≤ V
V
test = 0V)
Output leakage current; 0V ≤ V
ODT are disabled
V
Module ambient operating temperature
DDR2 SDRAM component case operating
temperature
DD
REF
REF
/V
Notes:
input 0V ≤ V
leakage current; V
DDQ
supply voltage relative to V
2
Stresses greater than those listed in Table 6 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions above those indicated in each device’s data sheet is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reli-
ability.
1. The refresh rate is required to double when 85°C < T
2. For further information, refer to technical note
on Micron’s Web site.
IN
≤ 0.95V (All other pins not under
REF
= valid V
OUT
SS
≤ V
REF
SS
DDQ
level
IN
1GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMM
≤ V
; DQ and
DD
8
;
Address inputs,
RAS#, CAS#, WE#, S#,
CKE, ODT, BA
CK, CK#
DM
DQ, DQS, DQS#
Commercial
Industrial
Commercial
Industrial
Micron Technology, Inc., reserves the right to change products or specifications without notice.
TN-00-08: Thermal
C
≤ 95°C.
Electrical Specifications
–250
Min
–0.5
–0.5
©2009 Micron Technology, Inc. All rights reserved.
–18
–40
–40
–5
–5
–5
0
0
Applications, available
+250
Max
+2.3
+2.3
+18
+70
+85
+85
+95
+5
+5
+5
Units
µA
µA
µA
°C
°C
°C
°C
V
V