mt16jss51264hy Micron Semiconductor Products, mt16jss51264hy Datasheet
mt16jss51264hy
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mt16jss51264hy Summary of contents
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... DDR3 SDRAM SODIMM MT16JSS51264HY – 4GB Features • DDR3 functionality and operations supported as de- fined in the component data sheet • 204-pin, small-outline dual in-line memory module (SODIMM) • Fast data transfer rates: PC3-12800, PC3-10600, PC3-8500, or PC3-6400 • 4GB (512 Meg x 64) • ...
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... The data sheet for the base device can be found on Micron’s Web site. Notes: 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Con- sult factory for current revision codes. Example: MT16JSS51264HY-1G1D1. PDF: 09005aef832ed836 jss16c512x64hy.pdf – Rev. C 8/09 ...
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Pin Assignments and Descriptions Table 4: Pin Assignments 204-Pin DDR3 SODIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ19 105 REFDQ 107 DQ0 57 DQ24 109 7 DQ1 ...
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... Input with write data. Center-aligned with write data. Serial data: SDA is a bidirectional pin used to transfer addresses and data into and out of the temperature sensor/SPD EEPROM on the module on the I Temperature event: The EVENT# pin is asserted by the temperature sensor when criti- cal temperature thresholds have been exceeded ...
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... Temperature sensor/SPD EEPROM power supply: +3.0V to +3.6V. Reference voltage: Control, command, and address (V Reference voltage: DQ Ground. Termination voltage: Used for control, command, and address (V No connect: These pins are not connected on the module. 5 Pin Assignments and Descriptions and V are connected to the mod- DD DDQ /2) ...
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... DQ Map Table 6: Component-to-Module DQ Map Component Reference Component Number DQ Module PDF: 09005aef832ed836 jss16c512x64hy.pdf – Rev. C 8/09 4GB (x64, DR): 204-Pin DDR3 SDRAM SODIMM Component Module Pin ...
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Functional Block Diagram Figure 2: Functional Block Diagram S1# S0# DQS0# DQS0 DM0 DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQS1# DQS1 DM1 DQ8 DQ DQ9 DQ DQ10 ...
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... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...
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... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...
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... Component specifications are available on Micron’s Web site. Module speed grades cor- relate with component speed grades, as shown below. Table 9: Module and Component Speed Grades DDR3 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1G6 ...
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I Specifications DD Table 10: DDR3 I Specifications and Conditions – 4GB DD Values are for the MT41J512M8THU DDR3 SDRAM only and are computed from values specified in the 4Gb TwinDie (512 Meg x 8) component data sheet Parameter Operating ...
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... TSE2002av, Serial Presence Detect with Temperature Sensor.” Serial Presence-Detect EEPROM Operation DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JE- DEC standard JC-45, “Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Modules.” ...
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Table 12: Sensor and EEPROM Serial Interface Timing (Continued) Parameter/Condition Start condition setup time Stop condition setup time EVENT# Pin The temperature sensor also adds the EVENT# pin (open drain). Not used by the SPD EEPROM, EVENT temperature ...
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Figure 3: EVENT# Pin Functionality Critical Alarm window (MAX) Alarm window (MIN) EVENT# interrupt mode EVENT# comparator mode EVENT# critical temperature only mode Table 13: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register ...
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Table 14: Pointer Register Bits 0– Table 15: Pointer Register Bits 0–2 Descriptions Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. ...
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Table 17: Capability Register Bit Description (Continued) Bit Description 4:3 Temperature resolution 00: 0.5°C LSB 01: 0.25°C LSB 10: 0.125°C LSB 11: 0.0625°C LSB 15:5 0: Must be set to zero Configuration Register Table 18: Configuration Register (Address: 0x01) 15 ...
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Table 19: Configuration Register Bit Descriptions (Continued) Bit Description 6 Alarm window lock bit 0: Alarm trips are not locked and can be changed 1: Alarm trips are locked and cannot be changed 7 Critical trip lock bit 0: Critical ...
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Figure 4: Hysteresis Applied to Temperature Around Trip Points Below window bit Above window bit 1. T Notes Hyst is the value set in the hysteresis bits of the configuration register. Table 20: Hysteresis Applied to Alarm ...
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Temperature Trip Point Registers The upper and lower temperature boundary registers are used to set the maximum and minimum values of the alarm window. LSB for these registers is 0.25°C. All RFU bits in the register will always report zero. ...
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Table 24: Temperature Register (Address: 0x05 Above Above Below MSB critical alarm alarm trip window window Table 25: Temperature Register Bit Descriptions Bit Description 13 Below alarm window 0: Temperature is equal to or above the lower ...
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... TYP Pin 1 63.6 (2.504) TYP Back view U10 3.0 (0.12) TYP 39.0 (1.535) 21.0 (0.827) TYP times occur. 21 Module Dimensions U4 30.15 (1.187) 29.85 (1.175) 20.0 (0.787) TYP TYP Pin 203 U9 4.0 (0.157) TYP Pin 2 TYP 24.8 (0.976) TYP Micron Technology, Inc. reserves the right to change products or specifications without notice. ©2008 Micron Technology, Inc. All rights reserved. ...