s71vs064rb0 Meet Spansion Inc., s71vs064rb0 Datasheet - Page 13
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s71vs064rb0
Manufacturer Part Number
s71vs064rb0
Description
Mirrorbit 1.8 Volt-only Simultaneous Read/write, Burst Mode Multiplexed Flash Memory And Burst Mode Psram
Manufacturer
Meet Spansion Inc.
Datasheet
1.S71VS064RB0.pdf
(17 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
s71vs064rb0AHT0L0
Manufacturer:
SPANSION
Quantity:
11 263
Company:
Part Number:
s71vs064rb0AHT0L0A
Manufacturer:
SPANSION
Quantity:
11 269
Part Number:
s71vs064rb0AHT3L0
Manufacturer:
SPANSION
Quantity:
20 000
January 26, 2009 S71VS_XS-R_00_05
PACKAGE
SYMBOL
SD SE
JEDEC
D x E
MD
ME
A1
A2
D1
E1
Øb
eE
eD
A
D
E
n
0.20
0.85
0.25
MIN
---
7.70 mm x 6.20 mm
PACKAGE
7.70 BSC.
6.20 BSC.
6.50 BSC.
4.50 BSC.
0.50 BSC.
0.25 BSC.
0.50 BSC
NSD 056
NOM
0.30
N/A
---
---
---
14
10
56
S71VS/XS-R Memory Subsystem Solutions
D a t a
MAX
1.20
0.97
0.35
---
Figure 4.5 NSD056—56-ball VFBGA 7.7 x 6.2 mm
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S h e e t
NOTE
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,
SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
3628 \ 16-038.22 \ 2.21.07
13