s72ns512pe0kfdgg Meet Spansion Inc., s72ns512pe0kfdgg Datasheet - Page 9
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s72ns512pe0kfdgg
Manufacturer Part Number
s72ns512pe0kfdgg
Description
The S72ns Series Is A Product Line Of Stacked Products Mcps And Pops , And Consists Of Ns Family Multiplexed Flash Memory Die Ddr Dram
Manufacturer
Meet Spansion Inc.
Datasheet
1.S72NS512PE0KFDGG.pdf
(14 pages)
5.
Notes:
1. Packing Type 0 is standard. Specify other options as required.
2. BGA package marking omits leading “S” and packing type designator from ordering part number.
3. Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid
February 14, 2008 S72NS-P_00_05
S72NS
combinations and to check on newly released combinations.
Product
Family
S72NS
Ordering Information
256
The order number (Valid Combination) is formed by the following:
Code Flash
P
Density
D a t a
(Mb)
128
256
512
D0
AJ
S h e e t
Technology
Process
B
P
S72NS-P MCP/PoP Memory System Solutions
L
( A d v a n c e
G
Density
DRAM
D0, E0
(Mb)
D0
3
Valid Combinations
PACKING TYPE
0 = Tray
2 = 7-inch Tape and Reel
3 = 13-inch Tape and Reel
FLASH and DDR SPEED
G = 66 MHz Flash, 133 MHz DRAM
C = 80 MHz Flash, 133 MHz DRAM
0 = 80 MHz Flash, 166 MHz DRAM
DDR SUPPLIER
G = DRAM Type 1 x16 DDR DRAM
L = DRAM Type 5 x16 DDR DRAM
PACKAGE MODIFIER
G = 133-ball, 11x10 mm, FBGA MCP
B = 133-ball, 8x8 mm, FBGA MCP
D = 128-ball, 12x12 mm, 0.45 mm ball, FBGA PoP (ALE128)
F = 128-ball, 12x12 mm, 0.48 mm ball, FBGA PoP (ALF128)
PACKAGE AND MATERIAL TYPE
AJ = Thin profile Fine-pitch BGA Pb-free MCP (0.5 mm pitch)
KF = Thin profile Fine-pitch BGA Pb-free PoP
AH = Thin profile Fine-pitch BGA Pb-free Low-Halogen MCP (0.5 mm pitch)
KH = Thin profile Fine--pitch BGA Pb-Free Low-Halogen PoP
DDR DRAM AND DATA FLASH DENSITY
D0 = 128 Mb DRAM, No Data Flash
E0 = 256 Mb DRAM, No Data Flash
PROCESS TECHNOLOGY
P = 90 nm, MirrorBit
CODE FLASH DENSITY
512 = 512 Mb
256 = 256 Mb
128 = 128 Mb
PRODUCT FAMILY
S72NS Multi-Chip Memory Subsystem (MCP/PoP))
1.8 V Multiplexed, SRW, Burst Mode Flash and DDR DRAM on Split Bus
I n f o r m a t i o n )
AHG, AJG, KFD
Package Type/
AJB, AHB
Material
®
Technology
DDR Vendor
G, L, J
Flash & DDR
G, C, 0
Speed
G, C
Packing
(Note 1)
0, 2, 3
Type
9