s71ns128pc0 Meet Spansion Inc., s71ns128pc0 Datasheet - Page 9
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s71ns128pc0
Manufacturer Part Number
s71ns128pc0
Description
Burst Mode Multiplexed Flash Memory And Burst Mode Multiplexed Psram
Manufacturer
Meet Spansion Inc.
Datasheet
1.S71NS128PC0.pdf
(12 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
s71ns128pc0ZHETV0
Manufacturer:
SPANSION
Quantity:
20 000
Part Number:
s71ns128pc0ZJETV0
Manufacturer:
SPANSION
Quantity:
20 000
4.3
December 13, 2007 S71NS-P_00_05
Physical Dimensions
PACKAGE
SYMBOL
SD / SE
JEDEC
D x E
MD
ME
D1
Øb
eD
A A2
A1
A2
E1
eE
A
D
E
n
CORNER
0.10 C
(2X)
PIN A1
G1,G2,G13,G14,H1,H2,H5,H6,H9,H10,H13,H14
D1,D2,D13,D14,E1,E2,E13,E14,F1,F2,F13,F14
MIN
0.20
0.85
0.25
---
56X
D a t a
9.20 mm x 8.00 mm
C1,C2,C5,C6,C9,C10,C13,C14
0.15 M
0.08 M C
A1
A2 ~ A13,B1 ~ B14
J1 ~ J14, K2 ~ K13
PACKAGE
9.20 BSC.
8.00 BSC.
4.50 BSC.
6.50 BSC.
0.50 BSC.
0.25 BSC.
0.50 BSC
NLB 056
6
INDEX MARK
NOM
b
0.30
N/A
10
14
56
---
---
---
C
9
S h e e t
A
SIDE VIEW
B
TOP VIEW
MAX
1.20
0.97
0.35
S71NS-P Memory Subsystem Solutions
---
Figure 4.3 NLB056—56-ball VFBGA 9.2 x 8.0 mm
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
( P r e l i m i n a r y )
NOTE
C
0.10
A
(2X)
E
B
C
0.08
0.20
eE
C
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
14
13
12
11
10
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,
SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
eD
SD
BOTTOM VIEW
K
7
J
H G
D1
F
E
D
C
B
A
SE
CORNER
PIN A1
3507\ 16-038.22 \ 7.14.5
7
E1
9