s71ns128pc0 Meet Spansion Inc., s71ns128pc0 Datasheet - Page 10
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s71ns128pc0
Manufacturer Part Number
s71ns128pc0
Description
Burst Mode Multiplexed Flash Memory And Burst Mode Multiplexed Psram
Manufacturer
Meet Spansion Inc.
Datasheet
1.S71NS128PC0.pdf
(12 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
s71ns128pc0ZHETV0
Manufacturer:
SPANSION
Quantity:
20 000
Part Number:
s71ns128pc0ZJETV0
Manufacturer:
SPANSION
Quantity:
20 000
10
PACKAGE
SYMBOL
JEDEC
SE SD
D X E
Ø b
MD
ME
A1
A2
D1
E1
eE
eD
D
A
E
n
---
56
0.20
10
14
E13,E14,F1,F2,F13,F14,G1
MIN
0.85
0.25
H5,H6,H9,H10,H13,H14,
N/A
C2,C5,C6,C9,C10,C13,
D1,D2,D13,D14,E1,E2,
9.20 mm x 8.00 mm
,G2,G13,G14,H1,H2,
A2- A13,B1-B14,C1,
NSB
J1-J14, K2-K13
PACKAGE
9.20 BSC.
8.00 BSC.
4.50 BSC.
0.50 BSC.
0.50 BSC.
0.25 BSC.
6.50 BSC
NOM
0.30
C14,
---
---
---
056
S71NS-P Memory Subsystem Solutions
MAX
1.20
0.97
0.35
---
Figure 4.4 NSB056—56-ball VFBGA 9.2 x 8.0 mm
D a t a
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
S h e e t
( P r e l i m i n a r y )
NOTES:
1.
2.
3.
4.
5.
8.
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
6
7
9
Y14.5M-1994.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
FOR MATRIX SIZE MD X ME.
IN A PLANE PARALLEL TO DATUM C.
B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN
THE OUTER ROW.
OUTER ROW SD OR SE = 0.000.
OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
DIMENSIONING AND TOLERANCING METHODS PER ASME
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3, SPP-010
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
“+” INDICATES THE THEORETICAL CENTER OF DEPOPULATED
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
e REPRESENTS THE SOLDER BALL GRID PITCH.
S71NS-P_00_05 December 13, 2007
NSB056 \ 16.038.22 \ 9.25.7