oq2541bhp NXP Semiconductors, oq2541bhp Datasheet - Page 35

• Manufacturer Part Number: oq2541bhp
• Description: Oq2541bhp; Oq2541bu Sdh/sonet Data And Clock Recovery Unit Stm1/4/16 Oc3/12/48 Ge
• Manufacturer: NXP Semiconductors

Philips Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2000 Sep 18
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
SDH/SONET data and clock recovery unit
STM1/4/16 OC3/12/48 GE
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
, SO, SOJ
PACKAGE
not suitable
suitable
not recommended
not recommended
(2)
WAVE
35
(3)(4)
(5)
SOLDERING METHOD
OQ2541BHP; OQ2541BU
suitable
suitable
suitable
suitable
suitable
REFLOW
Product specification
(1)