74AHCT1G04GW,125 NXP Semiconductors, 74AHCT1G04GW,125 Datasheet
74AHCT1G04GW,125
Specifications of 74AHCT1G04GW,125
74AHCT1G04GW-G
74AHCT1G04GW-G
935262752125
Related parts for 74AHCT1G04GW,125
74AHCT1G04GW,125 Summary of contents
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Inverter Rev. 07 — 31 May 2007 1. General description 74AHC1G04 and 74AHCT1G04 are high-speed Si-gate CMOS devices. They provide an inverting buffer. The AHC device has CMOS input switching levels and supply voltage range ...
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... NXP Semiconductors 4. Marking Table 2. Marking codes Type number 74AHC1G04GW 74AHC1G04GV 74AHCT1G04GW 74AHCT1G04GV 5. Functional diagram mna108 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning Fig 4. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin n. GND 74AHC_AHCT1G04_7 Product data sheet 74AHC1G04; 74AHCT1G04 ...
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... NXP Semiconductors 7. Functional description Table 4. Function table H = HIGH voltage level LOW voltage level Input Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I I input clamping current IK I output clamping current ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions For type 74AHC1G04 V HIGH-level input voltage LOW-level input voltage HIGH-level output voltage 4.0 mA 8.0 mA LOW-level output voltage 4.0 mA 8.0 mA input leakage GND ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions I supply current 5 additional per input pin supply current other inputs input I capacitance 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 3.0 ns. For test circuit see r f Symbol Parameter Conditions ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in Fig 5. Input (A) to output (Y) propagation delays Table 9. Measurement point Type Input V I 74AHC1G04 GND to V 74AHCT1G04 GND to 3.0 V Test data is given in Table 8. Definitions for test circuit Load capacitance including jig and probe capacitance. ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 7 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 8. Package outline SOT753 (SC-74A) 74AHC_AHCT1G04_7 Product data sheet 74AHC1G04; 74AHCT1G04 scale 3.1 1.7 3.0 0.6 0.95 2 ...
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... Release date 74AHC_AHCT1G04_7 20070531 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package SOT353 changed to SOT353-1 in • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 14 Abbreviations ...