74LVC1G08GV,125 NXP Semiconductors, 74LVC1G08GV,125 Datasheet
74LVC1G08GV,125
Specifications of 74LVC1G08GV,125
74LVC1G08GV
74LVC1G08GV
935272011125
Related parts for 74LVC1G08GV,125
74LVC1G08GV,125 Summary of contents
Page 1
Single 2-input AND gate Rev. 8 — 19 October 2010 1. General description The 74LVC1G08 provides one 2-input AND function. Inputs can be driven from either 3 devices. This feature allows the use of these ...
Page 2
... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range −40 °C to +125 °C 74LVC1G08GW −40 °C to +125 °C 74LVC1G08GV −40 °C to +125 °C 74LVC1G08GM −40 °C to +125 °C 74LVC1G08GF −40 °C to +125 °C 74LVC1G08GN −40 °C to +125 °C 74LVC1G08GS 4 ...
Page 3
... NXP Semiconductors 6. Pinning information 6.1 Pinning 74LVC1G08 GND 001aab638 Fig 4. Pin configuration SOT353-1 and SOT753 6.2 Pin description Table 3. Pin description Symbol Pin SOT353-1, SOT753 GND n. Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level 74LVC1G08 Product Specification ...
Page 4
... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK V input voltage I I output clamping current OK V output voltage O I output current ...
Page 5
... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V HIGH-level input voltage LOW-level input voltage HIGH-level output voltage = −100 μ −4 mA −8 mA −12 mA; V ...
Page 6
... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for load circuit see Symbol Parameter Conditions t propagation delay see power dissipation capacitance [1] Typical values are measured the same as t and PLZ PZL [ used to determine the dynamic power dissipation (P PD × ...
Page 7
... NXP Semiconductors Table 9. Measurement points Supply voltage 1. 2.7 V 2 3 5.5 V Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance External voltage for measuring switching times. ...
Page 8
... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 9 ...
Page 9
... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions) UNIT 0.100 1.1 0.40 0.26 mm 0.013 0.9 0.25 0.10 OUTLINE VERSION IEC SOT753 Fig 10. Package outline SOT753 (SC-74A) 74LVC1G08 Product Specification scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2.5 ...
Page 10
... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. 6× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 1.5 mm 0.5 0.04 0.17 1.4 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
Page 11
... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 6× (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 12 ...
Page 12
... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 0.95 mm nom 0.15 0.90 min 0.12 0.85 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
Page 13
... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.05 mm nom 0.15 1.00 min 0.12 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
Page 14
... NXP Semiconductors 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date 74LVC1G08 v.8 20101019 • Modifications: Added type number 74LVC1G08GN (SOT1115 / XSON6 package). • ...
Page 15
... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
Page 16
... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17. Contact information For more information, please visit: For sales office addresses, please send an email to: 74LVC1G08 Product Specification 16 ...
Page 17
... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 Abbreviations ...