74HC1G00GW,125 NXP Semiconductors, 74HC1G00GW,125 Datasheet
74HC1G00GW,125
Specifications of 74HC1G00GW,125
935245610125
Available stocks
Related parts for 74HC1G00GW,125
74HC1G00GW,125 Summary of contents
Page 1
NAND gate Rev. 04 — 11 July 2007 1. General description The 74HC1G00 and 74HCT1G00 are high speed Si-gate CMOS devices. They provide a 2-input NAND function. The HC device has CMOS input switching levels and supply ...
Page 2
... NXP Semiconductors 5. Functional diagram mna097 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning Fig 4. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin GND Functional description Table 4. Function table H = HIGH voltage level LOW voltage level Input 74HC_HCT1G00_4 Product data sheet 74HC1G00 ...
Page 3
... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK I output clamping current OK I output current O I supply current CC I ground current ...
Page 4
... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at T Symbol Parameter V HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I supply current CC C input capacitance I For type 74HCT1G00 V HIGH-level input IH voltage V LOW-level input ...
Page 5
... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 6.0 ns; All typical values are measured Symbol Parameter Conditions For type 74HC1G00 t propagation delay A and see power dissipation V = GND capacitance For type 74HCT1G00 t propagation delay A and see power dissipation V = GND capacitance [ the same as t and t ...
Page 6
... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 7 ...
Page 7
... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 8. Package outline SOT753 (SC-74A) 74HC_HCT1G00_4 Product data sheet scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2 ...
Page 8
... Release date 74HC_HCT1G00_4 20070711 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package SOT353 changed to SOT353-1 in • ...
Page 9
... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
Page 10
... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 2 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 14 Abbreviations ...