tsl2580 ETC-unknow, tsl2580 Datasheet - Page 28

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tsl2580

Manufacturer Part Number
tsl2580
Description
Light-to-digital Converter
Manufacturer
ETC-unknow
Datasheet
TSL2580, TSL2581
LIGHT-TO-DIGITAL CONVERTER
TAOS098 − MARCH 2010
PACKAGE CS
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted.
28
Copyright E 2010, TAOS Inc.
TOP VIEW
END VIEW
BOTTOM VIEW
375 + 30
375 + 30
700 + 55
500
500
C. The top of the photodiode active area is 410 μm below the top surface of the package.
D. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.
B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).
E. This drawing is subject to change without notice.
6
y
100
Figure 19. Package CS — Six-Lead Chipscale Packaging Configuration
1250
TYP 305
500
r
400 + 50
MECHANICAL DATA
6
y
www.taosinc.com
j 210 + 30
SIDE VIEW
6
5
4
r
BOTTOM VIEW
PIN OUT
Six-Lead Chipscale Device
The LUMENOLOGY r Company
1750
1
2
3
Lead Free
Pb

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