tsl2561cs Pacer Components, tsl2561cs Datasheet - Page 30
![no-image](/images/no-image-200.jpg)
tsl2561cs
Manufacturer Part Number
tsl2561cs
Description
Light-to-digital Converter
Manufacturer
Pacer Components
Datasheet
1.TSL2561CS.pdf
(38 pages)
- Current page: 30 of 38
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TSL2560, TSL2561
LIGHT-TO-DIGITAL CONVERTER
TAOS059L − JANUARY 2008
PACKAGE CS
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted.
30
Copyright E 2008, TAOS Inc.
TOP VIEW
END VIEW
BOTTOM VIEW
375 + 30
375 + 30
700 + 55
1398
171
500
500
C. The top of the photodiode active area is 410 μm below the top surface of the package.
D. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.
B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).
E. This drawing is subject to change without notice.
6
y
465
100
Figure 19. Package CS — Six-Lead Chipscale Packaging Configuration
1250
TYP 305
203
500
r
400 + 50
MECHANICAL DATA
6
y
www.taosinc.com
j 210 + 30
SIDE VIEW
6
5
4
r
BOTTOM VIEW
PIN OUT
Six-Lead Chipscale Device
The LUMENOLOGY r Company
1750
1
2
3
Lead Free
Pb
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