sc16c554dbib64 NXP Semiconductors, sc16c554dbib64 Datasheet - Page 50

• Manufacturer Part Number: sc16c554dbib64
• Description: 5 V, 3.3 V And 2.5 V Quad Uart, 5 Mbit/s Max. With 16-byte Fifos
• Manufacturer: NXP Semiconductors

Philips Semiconductors
Fig 33. Package outline SOT778-3 (HVQFN48)
SC16C554B_554DB_3
Product data sheet
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 6 x 6 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included
UNIT
mm
SOT778-3
VERSION
OUTLINE
terminal 1
index area
terminal 1
index area
max
A
1
(1)
E
L
0.05
0.00
h
A
12
1
1
e
0.25
0.15
13
b
48
IEC
- - -
0.2
c
D
6.1
5.9
(1)
D
e
D
1
h
JEDEC
3.95
3.65
D
1/2 e
- - -
h
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs
REFERENCES
E
6.1
5.9
b
Rev. 03 — 1 September 2005
(1)
37
3.95
3.65
0
24
E
h
JEITA
25
36
- - -
B
0.4
1/2 e
e
w
v
E
A
M
M
e
4.4
e
C
C
e
scale
1
2
2.5
A
B
4.4
e
2
A
0.5
0.3
L
SC16C554B/554DB
A
1
5 mm
0.1
y
v
1
C
PROJECTION
EUROPEAN
0.05
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
w
detail X
0.05
y
C
X
0.1
y
y
1
ISSUE DATE
04-06-16
04-06-23
c
SOT778-3
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