mc56f8006 Freescale Semiconductor, Inc, mc56f8006 Datasheet - Page 44

• Manufacturer Part Number: mc56f8006
• Description: Digital Signal Controller
• Manufacturer: Freescale Semiconductor, Inc

Specifications
8.4
This section includes information about recommended operating conditions.
44
XTAL driven by an external clock source
Input Voltage High (digital inputs)
Input Voltage Low (digital inputs)
Voltage difference V
Voltage difference V
Oscillator Input Voltage High
Oscillator Input Voltage Low
Using external clock source
Using relaxation oscillator
Device Clock Frequency
Recommended Operating Conditions
Characteristic
Supply voltage
Junction to package top
Junction-to-ambient thermal resistance determined per JEDEC JESD51–3 and JESD51–6.
Thermal test board meets JEDEC specification for this package.
Junction-to-board thermal resistance determined per JEDEC JESD51–8. Thermal test
board meets JEDEC specification for the specified package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1.
The cold plate temperature is used for the case temperature. Reported value includes the
thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the
package top and the junction temperature per JEDEC JESD51–2. When Greek letters are
not available, the thermal characterization parameter is written as Psi-JT
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power
dissipation of other components on the board, and board thermal resistance.
See
considerations.
Junction to ambient
Junction to board
Junction to case
Characteristic
Section 9.1, “Thermal Design
(@200 ft/min)
DD
SS
to V
to V
Table 17. 48LQFP Package Thermal Characteristics
MC56F8006/MC56F8002 Digital Signal Controller, Rev. 2
SSA
DDA
Table 18. Recommended Operating Conditions
(V
REFL x
V
FSYSCLK
Symbol
Natural Convection
DD,
V
V
ΔV
Four layer board
ΔV
IHOSC
ILOSC
V
V
= 0 V, V
Comments
V
IH
DD
IL
SS
Considerations,” for more detail on thermal design
DDA
(2s2p)
NOTE
SSA
Pin Groups 1, 2
Pin Groups 1, 2
Pin Group 4
Pin Group 4
= 0 V, V
Notes
Symbol
R
SS
R
R
Ψ
θJMA
θJB
θJC
JT
= 0 V)
–0.1
–0.1
–0.3
–0.3
Min
2.0
2.0
3
1
0
(LQFP)
Value
48
34
20
4
Typ
3.3
0
0
Freescale Semiconductor
V
°C/W
°C/W
°C/W
°C/W
Unit
DDA
Max
V
3.6
0.1
0.1
0.8
0.8
32
32
DD
+ 0.3
Unit
MHz
V
V
V
V
V
V
V