lpc11u23 NXP Semiconductors, lpc11u23 Datasheet - Page 62

• Manufacturer Part Number: lpc11u23
• Description: 32-bit Arm Cortex-m0 Microcontroller; Up To 32 Kb Flash; Up To 10 Kb Sram And 4 Kb Eeprom; Usb Device; Usart
• Manufacturer: NXP Semiconductors

NXP Semiconductors
LPC11U2X
Product data sheet
Fig 38. Reflow soldering for the HVQFN33 (7x7) package
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 2 — 13 January 2012
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
LPC11U2x
© NXP B.V. 2012. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
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