hcs10ms Intersil Corporation, hcs10ms Datasheet - Page 8

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hcs10ms

Manufacturer Part Number
hcs10ms
Description
Radiation Hardened Triple 3-input Nand Gate
Manufacturer
Intersil Corporation
Datasheet
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
87 x 88 mils
2.20mm x 2.24mm
Type: AlSi
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 x 4 mils
B1 (2)
A2 (3)
B2 (4)
C2 (5)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
Å
A1
(1)
(6)
Y2
HCS10MS
HCS10MS
GND
VCC
(14)
(7)
8
(13)
(8)
Y3
C1
Spec Number
(12) Y1
(11) C3
(10) B3
(9) A3
518747

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