l5961 STMicroelectronics, l5961 Datasheet - Page 4

• Manufacturer Part Number: l5961
• Description: Most Power Management Device Pmd
• Manufacturer: STMicroelectronics

Package information
3
4/7
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK
packages. ECOPACK
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 2.
(1) "D” and “E" do not include mold flash or protrusions Mold flash
DIM.
D
E
A2
G1
a1
e3
G
H
M
N
O
Q
U
A
b
e
F
h
L
S
T
X
Y
c
k
(1)
or protrusions shall not exceed 0.15 mm per side(0.006”)
(1)
PowerSSO-36 mechanical data and package dimensions
10.10
10.10
MIN.
2.15
2.15
0.18
0.23
0.55
7.4
4.1
6.5
0
0.1
G
M
TYP.
3.65
mm
0.5
8.5
2.3
4.3
1.2
0.8
2.9
1.0
5˚
A
®
B
LEAD COPLANARITY
packages are lead-free. The category of second Level Interconnect
T
MAX.
0.075
10.50
10.50
2.47
2.40
0.36
0.32
0.10
0.06
0.40
0.90
b
10˚
7.6
4.7
7.3
e3
D
0.084
0.084
0.007
0.009
0.398
0.291
0.398
0.022
0.161
0.256
MIN.
e
0
0.019
0.335
0.090
0.169
0.047
0.031
0.114
0.144
0.039
inch
TYP.
5˚
A
MAX.
0.097
0.094
0.003
0.014
0.012
0.413
0.299
0.004
0.002
0.413
0.016
0.035
0.185
0.287
10˚
B
MECHANICAL DATA
PowerSSO-36
(exposed pad)
Y
OUTLINE AND
BOTTOM VIEW
hx45
7587131 A
L
L5961
®