se97pw/1 NXP Semiconductors, se97pw/1 Datasheet - Page 4
se97pw/1
Manufacturer Part Number
se97pw/1
Description
Se97 Memory Module Temp Sensor With Integrated Spd
Manufacturer
NXP Semiconductors
Datasheet
1.SE97PW1.pdf
(43 pages)
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NXP Semiconductors
6. Pinning information
SE97_2
Product data sheet
6.1 Pinning
6.2 Pin description
Table 2.
Symbol
A0
A1
A2
V
SDA
SCL
EVENT
V
Fig 2. Pin configuration for TSSOP8
SS
DD
V
A0
A1
A2
SS
1
2
3
4
Pin description
Pin
1
2
3
4
5
6
7
8
SE97PW/1
SE97PW
Type
I
I
I
ground
I/O
I
O
power
Rev. 02 — 12 October 2007
002aab805
Description
I
input is overvoltage tolerant to support software write protection.
I
I
device ground
SMBus/I
external pull-up resistor.
SMBus/I
external pull-up resistor.
Thermal alarm output for high/low and critical temperature limit
(open-drain). Must have external pull-up resistor.
device power supply (3.0 V to 3.6 V); supports 1.7 V for
EEPROM read only.
2
2
2
8
7
6
5
C-bus/SMBus slave address bit 0 with internal pull-down. This
C-bus/SMBus slave address bit 1 with internal pull-down
C-bus/SMBus slave address bit 2 with internal pull-down
V
EVENT
SCL
SDA
DD
Memory module temp sensor with integrated SPD
2
2
C-bus serial data input/output (open-drain). Must have
C-bus serial clock input/output (open-drain). Must have
Fig 3. Pin configuration for HVSON8
index area
terminal 1
V
A0
A1
A2
SS
1
2
3
4
Transparent top view
SE97TK/1
SE97TK
© NXP B.V. 2007. All rights reserved.
002aab803
8
7
6
5
SE97
V
EVENT
SCL
SDA
DD
4 of 43
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