nud3124d ON Semiconductor, nud3124d Datasheet - Page 7

• Manufacturer Part Number: nud3124d
• Description: Automotive Inductive Load Driver
• Manufacturer: ON Semiconductor

total design. The footprint for the semiconductor packages
must be the correct size to ensure proper solder connection
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by T
temperature of the die, R
the device junction to ambient, and the operating
temperature, T
sheet for the SC-74 package, P
follows:
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature T
circuit board, solder paste must be applied to the pads.
Solder stencils are used to screen the optimum amount.
These stencils are typically 0.008 inches thick and may be
made of brass or stainless steel. For packages such as the
Surface mount board layout is a critical portion of the
The power dissipation of the SC-74 is a function of the
The values for the equation are found in the maximum
Prior to placing surface mount components onto a printed
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
INFORMATION FOR USING THE SC-74 SURFACE MOUNT PACKAGE
A
. Using the values provided on the data
J(max)
P
D
=
, the maximum rated junction
T
JA
J(max)
, the thermal resistance from
R
JA
- T
D
0.074
1.9
can be calculated as
A
0.037
0.037
0.95
0.95
SOLDER STENCIL GUIDELINES
SC-74 POWER DISSIPATION
A
of 25 C,
http://onsemi.com
NUD3124D
SC-74
0.094
2.4
7
interface between the board and the package. With the
correct pad geometry, the packages will self-align when
subjected to a solder reflow process.
one can calculate the power dissipation of the device which
in this case is 380 milliwatts.
the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 380 milliwatts.
There are other alternatives to achieving higher power
dissipation from the SC-74 package. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad . Using a board material such
as Thermal Clad, an aluminum core board, the power
dissipation can be doubled using the same footprint.
SC-59, SC-74, SC-70/SOT-323, SOD-123, SOT-23,
SOT-143, SOT-223, SO-8, SO-14, SO-16, and SMB/SMC
diode packages, the stencil opening should be the same as
the pad size or a 1:1 registration.
The 329 C/W for the SC-74 package assumes the use of
0.039
1.0
P
D
=
inches
0.028
mm
0.7
150 C - 25 C
329 C/W
= 380 milliwatts