nud3124d ON Semiconductor, nud3124d Datasheet
nud3124d
Available stocks
Related parts for nud3124d
nud3124d Summary of contents
Page 1
... April, 2003 - Rev Description Gate ORDERING INFORMATION Device NUD3124DMT1 1 http://onsemi.com MARKING DIAGRAM 6 SC-74 JW6 D CASE 318F PLASTIC 1 1 JW6 = Specific Device Code D = Date Code INTERNAL CIRCUIT DIAGRAM Drain Each Device 10 k 100 K Source Package Shipping SC-74 3000/Tape & Reel Publication Order Number: NUD3124D/D ...
Page 2
... Symbol T Operating Ambient Temperature A T Maximum Junction Temperature J T Storage Temperature Range STG P Total Power Dissipation D Derating above Thermal Resistance Junction–to–Ambient qJA NUD3124D Rating = 0 200 ms SOURCE Rating http://onsemi.com 2 Value Unit 150 mA 250 ...
Page 3
... Low to High Propagation Delay; Figure NO TAG, (V Transition Times: Fall Time; Figure NO TAG Rise Time; Figure NO TAG Fall Time; Figure NO TAG Rise Time; Figure NO TAG NUD3124D = 25 C, unless otherwise specified, each device) J Symbol V BRDSS I DSS I GSS V GS(th) R DS(on) ...
Page 4
... T = 300 ms Nominal 10 10% R Load Dump Pulse Suppressed: NOTE: Max. Voltage DUT is exposed to is NOTE: approximately 20 150 ms 20% Figure 3. Load Dump Waveform Definition NUD3124D = 25 C unless otherwise noted) t PHL 100 P , PULSE WIDTH (ms 90% 10% of Peak ...
Page 5
... -40 -25 - JUNCTION TEMPERATURE ( C) J Figure versus Junction Temperature GSS 1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 0.01 0.1 1.0 NUD3124D 180 160 140 120 100 80 60 290 320 350 -40 -25 -10 Figure 5. I 28.0 27.8 27.6 27.4 27.2 27.0 26.8 26.6 26.4 26.2 26 110 125 -40 -25 -10 T Figure ...
Page 6
... NUD3124D APPLICATIONS INFORMATION Gate (1) Micro Processor Signal for Relay NUD3124D Figure 9. Applications Diagram http://onsemi.com 12 V Battery - + Relay, Vibrator, or Inductive Load Drain ( 100 K Source (2) 6 ...
Page 7
... Solder stencils are used to screen the optimum amount. These stencils are typically 0.008 inches thick and may be made of brass or stainless steel. For packages such as the NUD3124D interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process ...
Page 8
... DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150 C 100 TIME ( MINUTES TOTAL) NUD3124D SOLDERING PRECAUTIONS The soldering temperature and time should not exceed 260 C for more than 10 seconds. When shifting from preheating to soldering, the maximum temperature gradient should less. ...
Page 9
... 0.05 (0.002) H NUD3124D PACKAGE DIMENSIONS SC-74 CASE 318F-04 ISSUE http://onsemi.com 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. ...
Page 10
... Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada NUD3124D JAPAN: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. http://onsemi.com 10 NUD3124D/D ...