buk214-50y NXP Semiconductors, buk214-50y Datasheet

no-image

buk214-50y

Manufacturer Part Number
buk214-50y
Description
Topfet High Side Switch Smd Version Of Buk209-50y
Manufacturer
NXP Semiconductors
Datasheet
1.BUK214-50Y.pdf (8 pages)

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
BUK214-50Y
Manufacturer:
NXP
Quantity:
310
Philips Semiconductors
DESCRIPTION
Monolithic single channel high side
protected power switch in
TOPFET2 technology assembled in
a 5 pin plastic surface mount
package.
APPLICATIONS
General controller for driving
lamps, motors, solenoids, heaters.
FEATURES
PINNING - SOT426
September 2002
TOPFET high side switch
SMD version of BUK209-50Y
PIN
mb
Vertical power TrenchMOS
Low on-state resistance
CMOS logic compatible
Very low quiescent current
Overtemperature protection
Load current limiting
Latched overload and
short circuit protection
Overvoltage and undervoltage
shutdown with hysteresis
On-state open circuit load
detection
Diagnostic status indication
Voltage clamping for turn off
of inductive loads
ESD protection on all pins
Reverse battery, overvoltage
and transient protection
1
2
3
4
5
Ground
Input
(connected to mb)
Status
Load
Battery
DESCRIPTION
QUICK REFERENCE DATA
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATION
SYMBOL
I
SYMBOL
V
I
T
R
L
L
STATUS
INPUT
GROUND
BG
j
ON
Fig.1. Elements of the TOPFET HSS with internal ground resistor.
1 2
3
4 5
PARAMETER
Nominal load current (ISO)
PARAMETER
Continuous off-state supply voltage
Continuous load current
Continuous junction temperature
On-state resistance
Fig. 2.
1
mb
PROTECTION
CONTROL &
CIRCUITS
RG
SYMBOL
T
j
= 25˚C
S
I
TOPFET
Product specification
Fig. 3.
HSS
BUK214-50Y
B
G
MAX.
MIN.
150
50
12
60
6
L
POWER
MOSFET
LOAD
BATT
Rev 2.000
UNIT
UNIT
mΩ
˚C
A
V
A

Related parts for buk214-50y

Image
Part Number
Description
Manufacturer
Datasheet
Request R
BUK214-50Y,118
Part Number:
BUK214-50Y,118
Description:
IC TOPFET HIGH SIDE SW D2PAK
Manufacturer:
NXP Semiconductors
Datasheet:
BUK214-50Y118.pdf (8 pages)
BUK214-50Y /T3
Part Number:
BUK214-50Y /T3
Description:
Power Switch ICs - Power Distribution TOPFET HIGH SIDE SW
Manufacturer:
NXP Semiconductors
LPC2420_60
Part Number:
LPC2420_60
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2420_60.pdf (86 pages)
LPC2458
Part Number:
LPC2458
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2458.pdf (80 pages)
LPC2468
Part Number:
LPC2468
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2468.pdf (85 pages)
LPC2470
Part Number:
LPC2470
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2470.pdf (91 pages)
LPC2478
Part Number:
LPC2478
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2478.pdf (93 pages)
XA-G30
Part Number:
XA-G30
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G30.pdf (36 pages)
XA-G37
Part Number:
XA-G37
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G37.pdf (37 pages)
XA-S3
Part Number:
XA-S3
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
XA-S3.pdf (52 pages)
LH75401_LH75411_N
Part Number:
LH75401_LH75411_N
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
LH75401_LH75411_N.pdf (63 pages)
LPC3130_3131
Part Number:
LPC3130_3131
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
LPC3130_3131.pdf (68 pages)
LPC3141FET180
Part Number:
LPC3141FET180
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3143FET180
Part Number:
LPC3143FET180
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3152FET208
Part Number:
LPC3152FET208
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors

buk214-50y Summary of contents

Page 1

... FUNCTIONAL BLOCK DIAGRAM STATUS INPUT CONTROL & PROTECTION CIRCUITS GROUND Fig.1. Elements of the TOPFET HSS with internal ground resistor. PIN CONFIGURATION Fig Product specification BUK214-50Y MIN. UNIT 6 MAX. UNIT 50 12 150 ˚ 25˚C 60 mΩ j BATT ...

Page 2

... 150˚C prior to turn-off j CONDITIONS Human body model 250 pF 1.5 kΩ CONDITIONS - is allowed as an overload condition but at the threshold Product specification BUK214-50Y MIN. MAX. UNIT -55 175 ˚C - 150 ˚ ...

Page 3

... V ≤ V ≤ 0 300 µ 300 µ Product specification BUK214-50Y MIN. TYP. MAX 5 25˚ 25˚ ...

Page 4

... Refer to mb CONDITIONS = 100 µ 100 µ TRUTH TABLE = 25 ˚C. mb CONDITIONS 9 V ≤ V ≤ Product specification BUK214-50Y MIN. TYP. MAX 160 5.5 7 8.5 - 2.4 3 1 100 TRUTH TABLE MIN. TYP. MAX. ...

Page 5

... OFF OFF OFF 0 1 OFF UV undervoltage OV overvoltage LC low current or open circuit load SC short circuit OT overtemperature 5 Product specification BUK214-50Y . MIN. TYP. MAX. 2 4.2 5 DESCRIPTION off on & normal L on & low current detect supply undervoltage lockout supply overvoltage shutdown ...

Page 6

... L 30 from input going low to 90 70 CONDITIONS Product specification BUK214-50Y MIN. TYP. MAX. UNIT µs - 180 250 150 170 190 ˚ ...

Page 7

... For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18. September 2002 2 scale max. 2.90 15.80 2.60 1.60 10.30 11 1.70 1.20 9.70 2.10 14.80 2.20 REFERENCES JEDEC EIAJ 1 , centre pin connected to mounting base. 7 Product specification BUK214-50Y 2 -PAK); 5 leads SOT426 mounting base EUROPEAN ISSUE DATE PROJECTION 98-12-14 99-06-25 Rev 2.000 ...

Page 8

... This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A 8 Product specification BUK214-50Y Rev 2.000 ...

Related keywords