buk213-50y NXP Semiconductors, buk213-50y Datasheet - Page 12

• Manufacturer Part Number: buk213-50y
• Description: Buk208-50y; Buk213-50y Single Channel High-side Topfet Tm
• Manufacturer: NXP Semiconductors

Philips Semiconductors
9. Package outline
9397 750 09384
Product data
Fig 17. SOT426.
Epoxy meets UL94 V0 at 1/8’’. Net mass: 1.5g. For soldering guidelines and surface mount footprint design, please refer to
Data Handbook SC18.
Plastic single-ended surface mounted package (Philips version of D
(one lead cropped)
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT426
4.50
4.10
A
H D
1.40
1.27
A 1
D
D 1
0.85
0.60
b
IEC
1
0.64
0.46
c
e
max.
11
D
2
e
JEDEC
E
1.60
1.20
3
D 1
4
e
REFERENCES
Rev. 02 — 06 June 2002
10.30
e
9.70
E
0
5
1.70
b
e
scale
BUK208-50Y; BUK213-50Y
EIAJ
2.5
2.90
2.10
L p
5 mm
15.80
14.80
H D
2.60
2.20
mounting
2
Q
-PAK); 5 leads
base
L p
Single channel high-side TOPFET™
A 1
Q
PROJECTION
c
EUROPEAN
A
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
ISSUE DATE
98-12-14
99-06-25
SOT426
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