buk217-50y NXP Semiconductors, buk217-50y Datasheet - Page 13

• Manufacturer Part Number: buk217-50y
• Description: Buk212-50y; Buk217-50y Single Channel High-side Topfet Tm
• Manufacturer: NXP Semiconductors

Philips Semiconductors
9397 750 10768
Product data
Fig 18. SOT263B-01.
Refer to mounting instructions for TO-220 packages. Epoxy meets UL94 VO at 1/8’’. Net mass: 2g
Plastic single-ended package; heatsink mounted; 1 mounting hole;
5-lead TO-220 lead form option
DIMENSIONS (mm are the original dimensions)
Notes
1. Terminal dimensions are uncontrolled in this zone.
2. Positional accuracy of the terminals is controlled in this zone.
UNIT
mm
SOT263B-01
OUTLINE
VERSION
4.5
4.1
A
1.39
1.27
A 1
0.85
0.70
b
0.7
0.4
c
D
L
IEC
15.8
15.2
D
D 1
6.4
5.9
D 1
e
m
1
10.3
9.7
E
5-lead (option)
TO-220
JEDEC
p 1
1.7
E
e
p
b
REFERENCES
9.8
9.7
Rev. 01 — 17 March 2003
L
5
0
5.9
5.3
L 1
L 4
q
w
5.2
5.0
L 3
L 2
M
scale
BUK212-50Y; BUK217-50Y
EIAJ
5
L 3
2.4
1.6
(1)
max.
L 4
0.5
10 mm
(2)
mounting
base
0.8
0.6
m
L 2
3.8
3.6
p
Q
R
Q 1
4.3
4.1
p 1
A
Single channel high-side TOPFET™
A 1
Q 2
R
3.0
2.7
q
PROJECTION
EUROPEAN
2.0
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Q
c
Q 1
4.5
L 1
Q 2
8.2
0.5
ISSUE DATE
R
01-01-11
SOT263B-01
0.4
w
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