ncp367 ON Semiconductor, ncp367 Datasheet - Page 10

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ncp367

Manufacturer Part Number
ncp367
Description
Ncp367 Battery Charge Front-end Protection, Usb And Ac/dc Supply Compliant
Manufacturer
ON Semiconductor
Datasheet

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
9X
2X
NOTE 4
REFERENCE
2X
PIN ONE
8X
0.05 C
0.05 C
0.10 C
8X
L
DETAIL A
K
0.10 C
É É É
É É É
É É É
e
e/2
BOTTOM VIEW
8
SIDE VIEW
TOP VIEW
1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
DETAIL B
D2
D
4
5
A1
0.10
E2
A B
8X
(A3)
b
E
C
0.10
0.05
A
0.10
A
C
B
C
C
SEATING
PLANE
NOTE 3
C
A
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
B
A
L1
DFN8, 2.0x2.2, 0.5P
B
http://onsemi.com
EXPOSED Cu
CASE 506BP−01
ALTERNATE TERMINAL
ISSUE A
Ç Ç Ç
Ç Ç Ç
É É É
CONSTRUCTIONS
CONSTRUCTIONS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DETAIL A
DETAIL B
ALTERNATE
10
L
MOLD CMPD
1.15
0.50
PITCH
SOLDERING FOOTPRINT*
1
L
Ç
Ç
Ç
Ç
Ç
Ç
Ç
Ç
NOTES:
1.63
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
Ç Ç
Ç Ç
Ç Ç
Ç Ç
ASME Y14.5M, 1994.
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
D2
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
Sales Representative
E2
L1
Ç Ç
Ç Ç
Ç Ç
Ç Ç
A
b
D
E
K
L
e
MIN
0.80
0.00
0.20
1.43
1.05
0.20
0.25
---
DIMENSIONS: MILLIMETERS
MILLIMETERS
0.20 REF
2.00 BSC
2.20 BSC
0.50 BSC
0.28
8X
TYP
0.22
---
---
---
---
---
---
---
0.45
8X
2.50
MAX
1.00
0.05
0.30
1.53
1.25
0.30
0.35
0.15
NCP367/D

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