tza3050 NXP Semiconductors, tza3050 Datasheet - Page 18
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
tza3050
Manufacturer Part Number
tza3050
Description
Tza3050 30 Mbits/s Up To 1.25 Gbits/s Burst Mode Laser Driver
Manufacturer
NXP Semiconductors
Datasheet
1.TZA3050.pdf
(24 pages)
- Current page: 18 of 24
- Download datasheet (122Kb)
Philips Semiconductors
13. Package outline
Fig 9. Package outline SOT560-1 (HBCC32)
9397 750 14806
Product data sheet
HBCC32: plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT560-1
max.
0.8
A
ball A1
index area
0.10
0.05
A
1
e 2
C
B
1
0.7
0.6
A
2
0.35
0.20
IEC
b
32
0.5
0.3
b 1
e
D 1
e 1
e 3
0.50
0.35
D
b 2
MO-217
JEDEC
0.50
0.35
b 3
0
REFERENCES
5.1
4.9
D
Rev. 03 — 7 April 2005
3.2
3.0
D 1
E 1
E
X
scale
JEITA
2.5
x C
e 4
5.1
4.9
x B
E
30 Mbits/s up to 1.25 Gbits/s burst mode laser driver
3.2
3.0
E 1
0.5
e
5 mm
4.2
e 1
v A
detail X
4.2
e 2
b 2
b 1
A 2
A
4.15
e 3
PROJECTION
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
EUROPEAN
A 1
4.15
A
e 4
w
b
w
v
v
y
b 3
M
M
M
M
0.2
C
C
C
C
v
w
v
A
A
M
M
TZA3050
w
v
0.15
B
B
w
C
C
M
M
ISSUE DATE
A
00-02-01
03-03-12
C
C
0.15
B
A
x
SOT560-1
B
0.05
y
18 of 24
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