tza3000 NXP Semiconductors, tza3000 Datasheet - Page 6

• Manufacturer Part Number: tza3000
• Description: Sdh/sonet Stm4/oc12 Optical Receiver
• Manufacturer: NXP Semiconductors

Philips Semiconductors
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
1997 Oct 17
handbook, full pagewidth
AGND
V
AGND
DREF
V
AGND
IPhoto
AGND
AGND
BWC
V
SUB
DGND
RFTEST
OUTSEL
DGND
V
OUTCML
CCA
CCA
ref
CCD
SDH/SONET STM4/OC12 optical receiver
SYMBOL
PAD
10
12
13
14
15
16
17
18
11
1
2
3
4
5
6
7
8
9
1.58
mm
x
COORDINATES
1100
1257
1398
1398
102
102
102
102
102
102
102
102
243
383
523
663
803
943
AGND
AGND
AGND
IPhoto
AGND
V CCA
DREF
V CCA
x
0
Fig.3 Bonding pad locations: TZA3000U.
y
0
1
2
3
4
5
6
7
8
32
9
1251
1111
971
814
674
534
395
254
105
105
105
105
105
105
105
105
263
403
31
10
y
(1)
30
11
TZA3000U
12
29
6
1.58 mm
13
Note
1. All coordinates are referenced, in m, to the bottom
28
OUTQCML
V
DGND
OUTPECL
OUTQPECL
DGND
DGND
LOS
LOSQ
LOSTTL
LOSTH
AGND
AGC
AGND
CCD
14
left-hand corner of the die.
27
SYMBOL
15
26
16
25
19
18
17
24
23
22
21
20
DGND
OUTQPECL
OUTPECL
DGND
V CCD
OUTQCML
OUTCML
V CCD
PAD
MGK882
19
20
21
22
23
24
25
26
27
28
29
30
31
32
COORDINATES
1398
1398
1398
1398
1398
1398
1283
1143
986
829
671
514
357
217
Objective specification
x
TZA3000
1103
1243
1400
1400
1400
1400
1400
1400
1400
1400
543
683
823
963
y
(1)