w19b320b Winbond Electronics Corp America, w19b320b Datasheet - Page 5

• Manufacturer Part Number: w19b320b
• Description: W19b320bt/b Datasheet
• Manufacturer: Winbond Electronics Corp America

2. FEATURES
Performance
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Architecture
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Software Features
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− Sector erases time: 0.4 Sec (typical)
− Chip erases time: 30Sec (typical)
− Byte/Word programming time: 7/9 s (typical)
− Active current (Read): 10 mA (typical)
− Active current (Read while Erase): 21 mA (typical)
− Standby current: 0.2 μA (typical)
− Eight 8KB, and sixty-three 64KB sectors
− Top or bottom boot block configurations available
− Supports full chip erase
− The Security Sector is an OTP; once the sector is programmed, it cannot be erased
− Flash device parameters stored directly on the device
− Allows software driver to identify and use a variety of different current and future Flash products
− Suspends erase operations to allow programming in same bank
− Software method: Toggle bit/Data polling
− Reduces overall programming time when issuing multiple program command sequences
2.7~3.6-volt write (program and erase) operations
Fast write operation
Read access time: 70 ns
Typical program/erase cycles: 100K
Twenty-year data retention
Ultra low power consumption
Sector erase architecture
Security Sector Size: 256 Bytes
JEDEC standard byte-wide and word-wide pinouts
Manufactured on WinStack 0.13μm process technology
Available packages: 48-pin TSOP and 48-ball TFBGA (6x8mm)
Compatible with common Flash Memory Interface (CFI) specification
Erase Suspend/Erase Resume
End of program detection
Unlock Bypass Program command
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W19B320BT/B DATASHEET
Publication Release Date:Dec. 25, 2007
Revisionv A3