m27v101 STMicroelectronics, m27v101 Datasheet - Page 6

no-image

m27v101

Manufacturer Part Number
m27v101
Description
1 Mbit 128kb X 8 Low Voltage Uv Eprom And Otp Eprom
Manufacturer
STMicroelectronics
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
m27v101-100F1
Manufacturer:
ST
Quantity:
2 037
Part Number:
m27v101-100F1
Manufacturer:
ST
0
Part Number:
m27v101-120K1
Manufacturer:
ST
0
Part Number:
m27v101-120N1
Manufacturer:
ST
0
Part Number:
m27v101-120N1DVP
Manufacturer:
ST
0
Part Number:
m27v101-12N1
Manufacturer:
ST
0
Part Number:
m27v101-150K1
Quantity:
5 510
Part Number:
m27v101-150K1
Quantity:
5 510
Part Number:
m27v101-200N1
Manufacturer:
PANASONIC
Quantity:
284
Part Number:
m27v101-200N1
Manufacturer:
ST
Quantity:
20 000
M27V101
Table 8B. Read Mode AC Characteristics
(T
Note: 1. V
Figure 5. Read Mode AC Waveforms
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require careful decoupling of the
devices. The supply current, I
ments that are of interest to the system designer:
the standby current level, the active current level,
and transient current peaks that are produced by
the falling and rising edges of E. The magnitude of
the transient current peaks is dependent on the
capacitive and inductive loading of the device at
the output. The associated transient voltage peaks
can be suppressed by complying with the two line
6/15
t
t
Symbol
GHQZ
EHQZ
A
t
t
t
t
GLQV
AXQX
AVQV
ELQV
= 0 to 70°C or –40 to 85 °C; V
2. Sampled only, not 100% tested.
(2)
(2)
CC
Q0-Q7
A0-A16
E
G
must be applied simultaneously with or before V
t
t
ACC
t
t
Alt
t
t
OE
OH
CE
DF
DF
Address Valid to Output
Valid
Chip Enable Low to
Output Valid
Output Enable Low to
Output Valid
Chip Enable High to
Output Hi-Z
Output Enable High to
Output Hi-Z
Address Transition to
Output Transition
Parameter
CC
, has three seg-
CC
tAVQV
tELQV
= 3.3V ± 10%; V
tGLQV
E = VIL, G = VIL
Test Condition
E = V
(1)
G = V
G = V
E = V
E = V
IL
PP
VALID
, G = V
and removed simultaneously or after V
IL
IL
IL
IL
PP
IL
output control and by properly selected decoupling
capacitors. It is recommended that a 0.1µF ceram-
ic capacitor be used on every device between V
and V
tor of low inherent inductance and should be
placed as close to the device as possible. In addi-
tion, a 4.7µF bulk electrolytic capacitor should be
used between V
es. The bulk capacitor should be located near the
power supply connection point. The purpose of the
bulk capacitor is to overcome the voltage drop
caused by the inductive effects of PCB traces.
= V
Min
0
0
0
CC
SS
-120
)
. This should be a high frequency capaci-
DATA OUT
Max
120
120
50
40
40
tAXQX
CC
Min
M27V101
0
0
0
tEHQZ
tGHQZ
and V
-150
Max
PP
150
150
60
50
50
.
SS
for every eight devic-
Min
0
0
0
-200
AI00713
Hi-Z
Max
200
200
90
70
70
Unit
ns
ns
ns
ns
ns
ns
CC

Related parts for m27v101