w9425g6eh Winbond Electronics Corp America, w9425g6eh Datasheet - Page 33

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w9425g6eh

Manufacturer Part Number
w9425g6eh
Description
4 M ? 4 Banks ? 16 Bits Ddr Sdram
Manufacturer
Winbond Electronics Corp America
Datasheet

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10.9 System Notes:
a. Pullup slew rate is characterized under the test conditions as shown in Figure 1.
b. Pulldown slew rate is measured under the test conditions shown in Figure 2.
c. Pullup slew rate is measured between (V
d. Evaluation conditions
e. The ratio of pullup slew rate to pulldown slew rate is specified for the same temperature and
f. Verified under typical conditions for qualification purposes.
Pulldown slew rate is measured between (V
Pullup and Pulldown slew rate conditions are to be met for any pattern of data, including all outputs
switching and only one output switching.
Example: For typical slew rate, DQ0 is switching
Typical:
Minimum:
Maximum:
voltage, over the entire temperature and voltage range. For a given output, it represents the
maximum difference between pullup and pulldown drivers due to process variation.
For minimum slew rate, all DQ bits are switching worst case pattern
For maximum slew rate, only one DQ is switching from either high to low, or low to high
The remaining DQ bits remain the same as for previous state
25
70
0
o
C (T Ambient), V
o
o
C (T Ambient), V
C (T Ambient), V
Output
Figure 1: Pullup slew rate test load
Figure 2: Pulldown slew rate test load
DDQ
DDQ
DDQ
VSSQ
= maximum, fast-fast process
= nominal, typical process
= minimum, slow-slow process
DDQ
DDQ
/2 - 320 mV ± 250 mV)
50 Ω
- 33 -
/2 + 320 mV ± 250 mV)
Test point
Publication Release Date:May 07, 2008
W9425G6EH
Revision A05

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