m24c64-df STMicroelectronics, m24c64-df Datasheet - Page 36

• Manufacturer Part Number: m24c64-df
• Description: 64 Kbit Serial I?c Bus Eeprom
• Manufacturer: STMicroelectronics

Package mechanical data
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Figure 18. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
1. Drawing is not to scale.
2. The central pad (E2 × D2 area in the above illustration) is internally pulled to V
3. The circle in the top view of the package indicates the position of pin 1.
Table 21.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
D2 (rev MB)
D2 (rev MC)
E2 (rev MC)
E2 (rev MB)
Symbol
be connected to any other voltage or signal line on the PCB, for example during the soldering process.
measuring.
eee
A1
L1
L3
A
D
E
K
b
e
L
(2)
2 × 3mm, package outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
0.550
0.020
0.250
2.000
1.600
3.000
0.200
0.500
Typ
millimeters
Doc ID 16891 Rev 23
0.450
0.000
0.200
1.900
1.500
1.200
2.900
0.100
1.200
0.300
0.300
0.300
0.080
Min
M24C64-DF, M24C64-W, M24C64-R, M24C64-F
1.700
0.300
0.600
0.050
0.300
2.100
1.600
3.100
1.600
0.500
0.150
Max
0.0217
0.0008
0.0098
0.0787
0.0630
0.1181
0.0079
0.0197
Typ
SS
. It must not be allowed to
inches
0.0177
0.0000
0.0079
0.0748
0.0591
0.0472
0.1142
0.0039
0.0472
0.0118
0.0118
0.0118
0.0031
Min
(1)
0.0236
0.0020
0.0118
0.0827
0.0669
0.0630
0.1220
0.0118
0.0630
0.0197
0.0059
Max