nvt2003 NXP Semiconductors, nvt2003 Datasheet - Page 2

• Manufacturer Part Number: nvt2003
• Description: Bidirectional Voltage-level Translator For Open-drain And Push-pull Applications
• Manufacturer: NXP Semiconductors

NXP Semiconductors
3. Ordering information
Table 1.
T
4. Functional diagram
NVT2003_04_06
Product data sheet
Type number
NVT2003DP
NVT2004TL
NVT2006BQ
NVT2006BS
NVT2006PW
NVT2006TL
amb
=

40

Ordering information
C to +85
Topside
mark
N2003
N04
N2006
N06
NVT2006
N06

C.







Fig 1.
Low 3.5  ON-state connection between input and output ports provides less signal
distortion
5 V tolerant I/O ports to support mixed-mode signal operation
High-impedance An and Bn pins for EN = LOW
Lock-up free operation
Flow through pinout for ease of printed-circuit board trace routing
ESD protection exceeds 3.5 kV HBM per JESD22-A114, 200 V MM per JESD22-A115,
and 1000 V CDM per JESD22-C101
Packages offered: TSSOP10, HXSON12, DHVQFN16, HVQFN16, TSSOP16,
HXSON16U
Number
of bits
3
4
6
6
6
6
Logic diagram of NVT2003/04/06 (positive logic)
Package
Name
TSSOP10
HXSON12
DHVQFN16 plastic dual in-line compatible thermal enhanced
HVQFN16
TSSOP16
HXSON16U plastic thermal enhanced extremely thin small outline
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 March 2011
plastic, thermal enhanced extremely thin small outline
Description
plastic thin shrink small outline package; 10 leads;
body width 3 mm
package; no leads; 12 terminals;
body 1.35  2.5  0.5 mm
very thin quad flat package; no leads;16 terminals;
body 2.5  3.5  0.85 mm
plastic thermal enhanced very thin quad flat package;
no leads; 16 terminals; body 3  3  0.85 mm
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
package; no leads; 16 terminals; UTLP based;
body 1.35  3.3  0.5 mm
A1
An
VREFA
NVT20xx
GND
SW
SW
VREFB
Bidirectional voltage-level translator
002aae132
EN
B1
Bn
NVT2003/04/06
© NXP B.V. 2011. All rights reserved.
Version
SOT552-1
SOT973-2
SOT763-1
SOT758-1
SOT403-1
SOT985-1
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