ip4853cx24 NXP Semiconductors, ip4853cx24 Datasheet - Page 16

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ip4853cx24

Manufacturer Part Number
ip4853cx24
Description
Sd, Mmc And T-?ash Memory Card Integrated Level Shifter With Psu, Emi ?lter And Esd Protection
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
15. Abbreviations
IP4853CX24_1
Product data sheet
Table 16.
Table 17.
Symbol
T
t
t
t
t
t
dT/dt
Acronym
DUT
EMI
ESD
FR4
MMC
NSMD
OSP
PCB
PSU
RoHS
1
2
3
4
5
Fig 9.
reflow(peak)
The device is capable of withstanding at least three reflows of this profile.
Pb-free solder reflow profile
Characteristics
Abbreviations
Parameter
peak reflow temperature
time 1
time 2
time 3
time 4
time 5
rate of change of
temperature
Description
Device Under Test
ElectroMagnetic Interference
ElectroStatic Discharge
Flame Retard 4
Multi Media Card
Non-Solder Mask Design
Organic Solderability Preservation
Printed-Circuit Board
Power Supply Unit
Restriction of Hazardous Substances
T
reflow(peak)
( C)
Rev. 01 — 22 July 2008
250
230
217
T
SD, MMC and T-flash memory card integrated level shifter
pre-heat
t
1
Conditions
soak time
time from T = 25 C to
T
time during T
time during T
time during T > 217 C
cooling rate
pre-heat
T = 0 C to +5 C
reflow(peak)
t
2
250 C
230 C
t
3
t
t
4
5
cooling rate
Min
230
60
240
-
10
30
-
2.5
IP4853CX24
001aai161
t (s)
Typ
-
-
-
-
-
-
-
-
© NXP B.V. 2008. All rights reserved.
Max
255
180
300
30
50
150
4.0
6
16 of 19
Unit
s
s
s
s
s
C
C/s
C/s

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