bgy148b NXP Semiconductors, bgy148b Datasheet - Page 8
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bgy148b
Manufacturer Part Number
bgy148b
Description
Hf Amplifier Modules
Manufacturer
NXP Semiconductors
Datasheet
1.BGY148B.pdf
(12 pages)
Philips Semiconductors
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210 C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250 C and damage the module.
The maximum allowed temperature is 250 C for
5 seconds.
The maximum ramp-up is 10 C per second.
The maximum cool-down is 5 C per second.
Cleaning
The following fluids may be used for cleaning:
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
1998 May 13
Alcohol
Bio-Act (Terpene Hydrocarbon)
Acetone.
HF amplifier modules
8
handbook, halfpage
Fig.17 Recommended reflow temperature profile.
( C)
300
T
200
100
0
0
1
BGY148A; BGY148B
2
3
Product specification
4
t (min)
MGM159
5