tl084bid STMicroelectronics, tl084bid Datasheet - Page 11

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tl084bid

Manufacturer Part Number
tl084bid
Description
General Purposej-fet Quad Operational Amplifiers
Manufacturer
STMicroelectronics
Datasheet

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TL084
5
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 25. TSSOP14 package mechanical data
Ref.
A1
A2
E1
A
D
E
K
b
e
L
c
PIN 1 IDENTIFICATION
A
A2
Min.
0.05
0.19
0.09
0.45
0.8
4.9
6.2
4.3
A1
1
b
Millimeters
0.65 BSC
Typ.
0.60
6.4
4.4
5
1
D
e
Max.
0.15
1.05
0.30
0.20
4.48
0.75
1.2
5.1
6.6
c
E1
Dimensions
0.002
0.031
0.007
0.004
0.193
0.244
0.169
0.018
Min.
K
L
0.0256 BSC
Inches
Package information
0.004
0.039
0.197
0.252
0.173
0.024
Typ.
E
0.0089
0.047
0.006
0.041
0.012
0.201
0.260
0.176
0.030
Max.
11/16

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