tea1750t-n1 NXP Semiconductors, tea1750t-n1 Datasheet - Page 26
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
tea1750t-n1
Manufacturer Part Number
tea1750t-n1
Description
Tea1750 Greenchip Iii Smps Control Ic
Manufacturer
NXP Semiconductors
Datasheet
1.TEA1750T-N1.pdf
(29 pages)
- Current page: 26 of 29
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NXP Semiconductors
13. Package outline
Fig 15. Package outline SOT109-1 (SO16)
TEA1750_1
Product data sheet
SO16: plastic small outline package; 16 leads; body width 3.9 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT109-1
0.069
max.
1.75
A
16
1
0.010
0.004
Z
0.25
0.10
pin 1 index
A
1
y
0.057
0.049
1.45
1.25
A
2
076E07
IEC
0.25
0.01
A
3
e
0.019
0.014
0.49
0.36
b
p
D
0.0100
0.0075
0.25
0.19
MS-012
JEDEC
c
REFERENCES
10.0
0.39
0.38
D
9.8
0
(1)
Rev. 01 — 6 April 2007
0.16
0.15
E
4.0
3.8
(1)
b
JEITA
scale
p
2.5
1.27
0.05
9
8
e
w
0.244
0.228
H
6.2
5.8
c
M
E
0.041
5 mm
A
1.05
2
L
A
1
0.039
0.016
1.0
0.4
L
p
0.028
0.020
H
0.7
0.6
E
Q
E
detail X
GreenChip III SMPS control IC
PROJECTION
EUROPEAN
0.25
0.01
L
v
L
p
Q
0.25
0.01
(A )
w
3
A
0.004
TEA1750
0.1
© NXP B.V. 2007. All rights reserved.
y
A
ISSUE DATE
X
v
99-12-27
03-02-19
M
0.028
0.012
Z
0.7
0.3
(1)
A
SOT109-1
8
0
26 of 29
o
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