tea1507p-n1 NXP Semiconductors, tea1507p-n1 Datasheet - Page 16

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tea1507p-n1

Manufacturer Part Number
tea1507p-n1
Description
Greenchipii Smps Control Ic
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
PACKAGE OUTLINE
2000 Dec 05
DIP8: plastic dual in-line package; 8 leads (300 mil)
GreenChip II SMPS control IC
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT97-1
max.
0.17
4.2
A
0.020
min.
0.51
A
1
L
050G01
max.
0.13
A
3.2
IEC
Z
2
8
1
pin 1 index
0.068
0.045
1.73
1.14
b
b
D
e
0.021
0.015
0.53
0.38
b
1
MO-001
JEDEC
0.042
0.035
1.07
0.89
4
5
b
b
REFERENCES
1
2
0
A
b
0.014
0.009
1
2
0.36
0.23
w
c
A
E
M
2
SC-504-8
scale
EIAJ
D
0.39
0.36
A
16
9.8
9.2
5
(1)
6.48
6.20
0.26
0.24
E
(1)
10 mm
2.54
0.10
e
7.62
0.30
e
1
c
3.60
3.05
0.14
0.12
(e )
M
L
M
PROJECTION
1
H
EUROPEAN
E
8.25
7.80
0.32
0.31
M
E
Preliminary specification
10.0
0.39
0.33
M
8.3
H
TEA1507
ISSUE DATE
0.254
0.01
95-02-04
99-12-27
w
SOT97-1
0.045
max.
1.15
Z
(1)

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