nlasb3157 ON Semiconductor, nlasb3157 Datasheet - Page 10

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nlasb3157

Manufacturer Part Number
nlasb3157
Description
Single Spdt Analog Switch
Manufacturer
ON Semiconductor
Datasheet

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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
2X
7X
2X
REFERENCE
0.10 C
PIN ONE
0.10 C
0.08 C
0.10 C
L1
Í Í Í
Í Í Í
Í Í Í
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
BOTTOM VIEW
1
6
E
4
3
A1
4X
A3
e
b
A
6X
B
D
0.10 C
0.05 C
5X
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
A
L
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
WDFN6, 1.2x1.0x0.4P
http://onsemi.com
C
CASE 506AS−01
A
NOTE 3
NLASB3157
SEATING
PLANE
MT SUFFIX
B
ISSUE A
10
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
PITCH
0.40
MOUNTING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
L2
A
b
D
E
L
0.42
e
6X
0.70
0.00
0.15
0.30
0.40
MILLIMETERS
MIN
0.20 REF
1.00 BSC
1.20 BSC
0.40 BSC
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
0.80
0.05
0.25
0.40
0.50
DIMENSIONS: MILLIMETERS
1.07
0.22
6X
NLASB3157/D

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