adg5213bcpz-rl7 Analog Devices, Inc., adg5213bcpz-rl7 Datasheet - Page 19

• Manufacturer Part Number: adg5213bcpz-rl7
• Description: High Voltage Latch-up Proof, Quad Spst Switches Adg5212/adg5213
• Manufacturer: Analog Devices, Inc.

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG5212BRUZ
ADG5212BRUZ-RL7
ADG5212BCPZ-RL7
ADG5213BRUZ
ADG5213BRUZ-RL7
ADG5213BCPZ-RL7
1
Z = RoHS Compliant Part.
1
INDICATOR
SEATING
PLANE
0.80
0.75
0.70
PIN 1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
0.15
0.05
4.50
4.40
4.30
PIN 1
TOP VIEW
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
Figure 34. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4.10
4.00 SQ
3.90
Figure 33. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
16
1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
4 mm × 4 mm Body, Very Very Thin Quad
5.10
5.00
4.90
0.10
Dimensions shown in millimeters
Dimensions shown in millimeters
0.30
0.19
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
Package Description
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9
8
Rev. 0 | Page 19 of 20
1.20
MAX
0.20 REF
SEATING
PLANE
6.40
BSC
0.45
0.40
0.35
BSC
(CP-16-17)
0.65
0.05 MAX
0.02 NOM
(RU-16)
COPLANARITY
0.20
0.09
0.08
12
9
0.35
0.30
0.25
13
8
BOTTOM VIEW
8°
0°
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
16
5
1
4
0.75
0.60
0.45
0.20 MIN
2.70
2.60 SQ
2.50
ADG5212/ADG5213
Package Option
RU-16
RU-16
CP-16-17
RU-16
RU-16
CP-16-17