sak-xc2387a-56fxxl Infineon Technologies Corporation, sak-xc2387a-56fxxl Datasheet - Page 136
sak-xc2387a-56fxxl
Manufacturer Part Number
sak-xc2387a-56fxxl
Description
16/32-bit Single-chip Microcontroller With 32-bit Performance
Manufacturer
Infineon Technologies Corporation
Datasheet
1.SAK-XC2387A-56FXXL.pdf
(137 pages)
- Current page: 136 of 137
- Download datasheet (2Mb)
5.2
When operating the XC238xA in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (
The internal power consumption is defined as
P
The static external power consumption caused by the output drivers is defined as
P
The dynamic external power consumption caused by the output drivers (
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
•
•
•
•
Data Sheet
INT
IOSTAT
Reduce
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
=
P
V
INT
= Σ((
DDP
+
Thermal Considerations
V
×
V
P
DDP
I
DDP
IOSTAT
DDP
, if possible in the system
-
V
(switching current and leakage current).
OH
+
) ×
P
IODYN
I
OH
) + Σ(
) ×
R
ΘJA
V
OL
×
I
OL
XC2000 Family Derivatives / Base Line
136
)
R
ΘJA
” quantifies these parameters. The
Package and Reliability
XC2385A, XC2387A
P
IODYN
V2.0, 2009-03
) depends
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