ncn6024 ON Semiconductor, ncn6024 Datasheet - Page 14

• Manufacturer Part Number: ncn6024
• Description: Compact And Low Cost Smart Card Interface Ic
• Manufacturer: ON Semiconductor

−Y−
−X−
E
28
1
B
0.025
PIN 1 IDENT
D
M
T
X
G
S
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Y
A1
15
14
S
28X
0.52
28X
H
A
0.25
1.30
M
−T−
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
Y
0.10
SEATING
PLANE
http://onsemi.com
M
14
1
CASE 751F−05
SOIC−28 WB
ISSUE H
11.00
8X
14
DIMENSIONS: MILLIMETERS
28
15
C
PITCH
1.27
L
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
PROTRUSION
PROTRUSION. ALLOWABLE DAMBER
PR5OTRUSION SHALL NOT BE 0.13 TOTATL IN
EXCESS OF B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
A1
G
M
A
B
C
D
E
H
L
17.80
10.05
MILLIMETERS
MIN
2.35
0.13
0.35
0.23
7.40
0.41
1.27 BSC
0
_
18.05
10.55
MAX
2.65
0.29
0.49
0.32
7.60
0.90
8
_