sta333mlj13tr STMicroelectronics, sta333mlj13tr Datasheet - Page 12

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sta333mlj13tr

Manufacturer Part Number
sta333mlj13tr
Description
Sound Terminal Tm 2 Channel Microless High Efficiency Digital Audio System
Manufacturer
STMicroelectronics
Datasheet

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Package thermal characteristics
6
12/15
Package thermal characteristics
A thermal resistance of 25 °C per Watt can be achieved using a ground copper area of
3 x 3 cm, and using 16 vias, on the PCB (see
within the device depends primarily on the supply voltage, load impedance and output
modulation level.
The max estimated dissipated power for the STA333ML is 3 W. This gives, with the
suggested board copper area, a maximum ∆Tj of 75 °C. This gives a safety margin before
the thermal protection intervention is invoked (T
a 50 °C is the maximum ambient temperature.
Figure 7.
Thermal characteristic
Figure
j
=150 °C) in consumer environments where
7). The amount of power dissipated
STA333ML

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