ptn3360d NXP Semiconductors, ptn3360d Datasheet - Page 20

• Manufacturer Part Number: ptn3360d
• Description: Enhanced Performance Hdmi/dvi Level Shifter With Active Ddc Buffer, Supporting Deep Color Mode
• Manufacturer: NXP Semiconductors

NXP Semiconductors
PTN3360D_1
Product data sheet
12.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 14.
Table 15.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 14
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
15
6.
Rev. 01 — 16 June 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
HDMI/DVI level shifter supporting deep color mode
3
3
)
)
Figure
350 to 2000
260
250
245
6) than a SnPb process, thus
≥ 350
220
220
PTN3360D
> 2000
260
245
245
© NXP B.V. 2010. All rights reserved.
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