tja1041 NXP Semiconductors, tja1041 Datasheet - Page 20

• Manufacturer Part Number: tja1041
• Description: High Speed Can Transceiver
• Manufacturer: NXP Semiconductors

NXP Semiconductors
14. Bare die outline
TJA1041_6
Product data sheet
Table 9.
[1]
Symbol
TXD
GND
V
RXD
V
EN
INH
ERR
WAKE
V
SPLIT
CANL
CANH
STB
Fig 11. Bonding pad locations
CC
I/O
BAT
All x/y coordinates represent the position of the center of each pad (in m) with respect to the left hand
bottom corner of the top aluminium layer.
The reverse side of the bare die must be connected to ground.
Bonding pad locations
Rev. 06 — 5 December 2007
Pad
1
2
3
4
5
6
7
8
9
10
11
12
13
14
x
0
2
3
4
5
0
y
6
TJA1041U
7
1
Coordinates
x
664.25
75.75
115.5
115.5
115.5
264.5
667.75
1076.75
1765
1765
1765
1765
1751
940.75
14
8
mgu984
[1]
13
12
11
10
9
High speed CAN transceiver
y
3004.5
3044.25
2573
1862.75
115.5
114
85
115.5
85
792.5
1442.25
2115
3002.5
3004.5
© NXP B.V. 2007. All rights reserved.
TJA1041
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