uja1061 NXP Semiconductors, uja1061 Datasheet - Page 45
uja1061
Manufacturer Part Number
uja1061
Description
Low Speed Can/lin System Basis Chip
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1061.pdf
(74 pages)
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NXP Semiconductors
8. Thermal characteristics
UJA1061_5
Product data sheet
Fig 15. Thermal model of the HTSSOP32 package
V1 dissipation
6 K/W
Rev. 05 — 22 November 2007
V2 dissipation
20 K/W
Fault-tolerant CAN/LIN fail-safe system basis chip
6 K/W
R th(c-a)
V3 dissipation
23 K/W
T
T
case
amb
(heat sink)
other dissipation
© NXP B.V. 2007 Nov 23. All rights reserved.
UJA1061
001aac327
6 K/W
T
vj
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