isp1102a NXP Semiconductors, isp1102a Datasheet - Page 19

• Manufacturer Part Number: isp1102a
• Description: Isp1102a Advanced Universal Serial Bus Transceiver
• Manufacturer: NXP Semiconductors

NXP Semiconductors
ISP1102A_1
Product data sheet
Table 16.
Table 17.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 13. Temperature profiles for large and small components
•
•
2.5
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 16
MSL: Moisture Sensitivity Level
temperature
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
17
Rev. 01 — 15 February 2007
13.
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
3
3
)
)
350 to 2000
260
250
245
220
220
350
Advanced USB transceiver
temperature
peak
ISP1102A
> 2000
260
245
245
© NXP B.V. 2007. All rights reserved.
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