mpc5561 Freescale Semiconductor, Inc, mpc5561 Datasheet - Page 6

• Manufacturer Part Number: mpc5561
• Description: Mpc5561 Power Architecture Tm 32-bit Mcu For Automotive
• Manufacturer: Freescale Semiconductor, Inc

Features
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Fully static operation, up to 132 MHz
–40° to 150° C junction temperature
1.5 V Core, 3.0–5.25 V I/O, 1.8–3.3 V external bus and Nexus pins
324-pin plastic ball grid array (TEPBGA)
416-pin plastic ball grid array (TEPBGA)
Low power design
— Less than 1.0 W power dissipation
— Designed for dynamic power management of core and peripherals
— Software-controlled clock gating of peripherals
— Separate power supply for stand-by operation for portion of internal SRAM
Fabricated in 0.13 μm process
Single issue, 32-bit Book E compliant Power Architecture™ technology e200z6 CPU core
32-channel enhanced direct memory access controller (eDMA)
Interrupt controller (INTC) capable of handling 208 selectable-priority interrupt sources
Frequency modulated phase-locked loop (FMPLL)
External bus interface (EBI) with error correction status module (ECSM)
System integration unit (SIU)
1 MB on-chip Flash with Flash bus interface unit (FBIU)
192 KB on-chip static RAM
Boot assist module (BAM)
24-channel enhanced modular I/O system (eMIOS)
Two enhanced queued analog-to-digital converter (eQADC) modules
Two deserial serial peripheral interface (DSPI) modules
Four enhanced serial communication interface (eSCI) modules
Two controller area network (FlexCAN) modules
Dual channel FlexRay controller
Parallel digital interface (PDI)
Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard
Device/board test support per Joint Test Action Group (JTAG) of IEEE (IEEE 1149.1)
On-chip voltage regulator controller for regulating 3.3 V down to 1.5 V for core logic
Operating Parameters
Packages
Chip Level Features
MPC5561 Microcontroller Product Brief, Rev. 1
Freescale Semiconductor