mm908e621 Freescale Semiconductor, Inc, mm908e621 Datasheet - Page 7

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mm908e621

Manufacturer Part Number
mm908e621
Description
Integrated Quad Half-bridge And Triple High-side With Embedded Mcu And Lin For High End Mirror
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Table 2. Maximum Ratings (continued)
damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
THERMAL RATINGS
Notes
Operating Ambient Temperature
Operating Junction Temperature
Storage Temperature
Peak Package Reflow Temperature During Reflow
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent
3.
4.
5.
6.
7.
The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions.
Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Rating
(3)
(4)
(6)
,
(7)
Symbol
T
T
PPRT
T
STG
T
A
J
-40 to 125
-40 to 150
-40 to 85
Value
Note 7
MAXIMUM RATINGS
Unit
908E621
°C
°C
°C
°C
7

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